AF500-265005, Thermal Interface Products Thermal interface material, AF500, non-silicone- based, 26.25x50x0.5 mm
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9 шт., срок 5-7 недель
12 890 руб.
1 шт.
на сумму 12 890 руб.
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от 3 224 руб. × 4 платежа
от 3 224 руб. × 4 платежа
Описание
Thermal Management\Thermal Interface Products
Thermal Pads CUI Devices Thermal Pads feature electrical isolation, conductivity ratings from 1.0W/m*K to 6.0W/m*K, and a dielectric breakdown of 2500V. Designed with non-silicone or silicone elastomer, these naturally sticky pads from CUI Devices help move heat effectively by being a conductive layer between Peltier devices, heat sinks, and other surfaces.
Технические параметры
| Brand: | CUI Devices |
| Breakdown Voltage: | 2.5 kVAC |
| Color: | Gray |
| Factory Pack Quantity: | 1 |
| Flammability Rating: | UL 94 V-0 |
| Manufacturer: | CUI Devices |
| Material: | Non-Silicone Elastomer |
| Maximum Operating Temperature: | +125 C |
| Minimum Operating Temperature: | -45 C |
| Product Category: | Thermal Interface Products |
| Product Type: | Thermal Interface Products |
| Product: | Thermally Conductive Gap Pad |
| Subcategory: | Thermal Management |
| Tensile Strength: | 30 psi |
| Thermal Conductivity: | 3 W/m-K |
| Thickness: | 0.5 mm |
| Type: | Thermal Pad |
Техническая документация
Datasheet
pdf, 217 КБ
Сроки доставки
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