TS391LT500C, Solder Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
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см. техническую документацию
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1 шт., срок 5-7 недель
Бесплатная доставка 5Post, СДЭК и Я.Доставка
38 630 руб.
1 шт.
на сумму 38 630 руб.
Плати частями
от 9 659 руб. × 4 платежа
от 9 659 руб. × 4 платежа
Описание
Tools & Supplies\Soldering\Solder
TS391 No-Clean Solder PasteChip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.
Технические параметры
| Состав | олово(Sn)42% висмут(Bi) 57.6%серебро(Ag)0.4% | |
| Alloy: | Sn42/Bi57.6/Ag0.4 | |
| Brand: | Chip Quik | |
| Contains Lead: | No | |
| Description/Function: | Thermally stable solder paste 500g cartridge | |
| Manufacturer: | Chip Quik | |
| Package Type: | Cartridge | |
| Product Category: | Solder | |
| Product Type: | Solder | |
| Product: | Solder | |
| Subcategory: | Solder & Equipment | |
| Type: | Paste, No Clean | |
| Вес, г | 0.01 |
Техническая документация
Datasheet
pdf, 103 КБ
Сроки доставки
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